Descrizione del progetto
Far progredire le nuove tecnologie di sistemi elettronici
Con la crescente domanda di sistemi intelligenti sia nel settore industriale che in quello privato, è logico che la tecnologia intelligente abbia trovato il suo posto nel settore automobilistico. La promessa dei sistemi avanzati di assistenza alla guida (ADAS) e dei veicoli completamente automatizzati ha creato un’opportunità di progresso e profitti per gli innovatori attivi nel campo dei sistemi intelligenti e dei sensori radar per auto intelligenti. Il progetto Car2TERA, finanziato dall’UE, approfittando di questa domanda, farà progredire ulteriormente la tecnologia dei sistemi elettronici automobilistici intelligenti. Per raggiungere questo obiettivo, svilupperà nuovi sistemi elettronici intelligenti sub-THz utilizzando la tecnologia silicio-germanio, il silicio microlavorato e le tecnologie nanoelettroniche. Car2TERA rafforzerà una solida posizione europea nel campo dei sistemi di sensori elettronici avanzati e intelligenti.
Obiettivo
The objective of Car2TERA is to develop emerging sub-THz (150-330 GHz) smart electronic systems based on latest semiconductor, microsystem and nanoelectronics technologies, and to implement TRL-4 demonstrators in two high-potential application scenarios: (1) a new class of compact, high-resolution, electronic-beam-steering short-range car radar sensors, with the primary application being in-cabin passenger monitoring (currently fastest growing car sensor market) for individually and real-time adjusted crash mitigation measures; (2) short-distance, high data-rate THz-over-plastic data links for telecommunication radio-access and backbone networks facilitating the data growth demanded by 5G and IoT.
Car2TERA combines, for the first time, the results of recent achievements in semiconductor, micro- and nanoelectronics scientific projects, including the Graphene Flagship, an ERC and several EU collaboration projects, with the following emerging THz technologies: (1) 600-GHz-fmax SiGe monolithic-microwave integrated circuits (MMICs); (2) silicon micromachining for system integration, packaging and phased-array antenna front-end; (3) integrated MEMS reconfigurability; and (4) large-bandwidth, high-linearity graphene MMICs; (4) advanced signal processing including OFDM radar signals and AI sensor fusion.
The consortium: Veoneer, world’s largest car safety equipment manufacturer; Ericsson, world leading in telecommunication systems; Infineon, world’s largest manufacturer of SiGe radar chip sets; the academic partners Chalmers and KTH, leading in MMIC design and micromachining/THz MEMS; and three SMEs leading in sub-THz technologies and 2D-materials.
With European car module manufacturers holding a market share of 79% on car radars, and European semiconductor manufacturers 90% on SiGe car-radar chip sets, this project aims at extending Europe’s success story on advanced, smart electronic sensor systems into the sub-THz frequency spectrum and into new emerging applications.
Campo scientifico
- engineering and technologynanotechnologynano-materialstwo-dimensional nanostructuresgraphene
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationstelecommunications networksdata networks
- engineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationsradio technologyradar
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensors
- natural sciencesphysical scienceselectromagnetism and electronicssemiconductivity
Parole chiave
Programma(i)
Argomento(i)
Meccanismo di finanziamento
RIA - Research and Innovation actionCoordinatore
9500 Villach
Austria
L’organizzazione si è definita una PMI (piccola e media impresa) al momento della firma dell’accordo di sovvenzione.