SILICON WAFER FOR AN ELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
Antrags-/Publikationsnummer:
17
717389
Datum:
2017-04-11
Antragsteller:
NEXWAFE GMBH
METHOD AND CARRIER ELEMENT FOR PRODUCING A WAFER LAYER
Antrags-/Publikationsnummer:
20
20079032
Datum:
2020-10-15
Antragsteller:
NEXWAFE GMBH
PROCESS CHAMBER GUIDE, PROCESS CHAMBER, AND METHOD FOR GUIDING A SUBSTRATE CARRIER IN A PROCESS POSITION
Antrags-/Publikationsnummer:
18
712202
Datum:
2018-03-19
Antragsteller:
NEXWAFE GMBH
APPARATUS AND METHOD FOR ETCHING ONE SIDE OF A SEMICONDUCTOR SUBSTRATE
Antrags-/Publikationsnummer:
16
819015
Datum:
2016-12-08
Antragsteller:
NEXWAFE GMBH
PROCESS AND APPARATUS FOR REMOVAL OF IMPURITIES FROM CHLOROSILANES
Antrags-/Publikationsnummer:
18
792913
Datum:
2018-10-19
Antragsteller:
NEXWAFE GMBH
METHOD AND DEVICE FOR PRODUCING A SEMICONDUCTOR LAYER
Antrags-/Publikationsnummer:
17
717389
Datum:
2016-09-27
Antragsteller:
NEXWAFE GMBH
APPARATUS AND METHOD FOR ETCHING ONE SIDE OF A SEMICONDUCTOR LAYER OF A WORKPIECE
Antrags-/Publikationsnummer:
19
723738
Datum:
2019-05-06
Antragsteller:
NEXWAFE GMBH
METHOD AND APPARATUS FOR THE CONTINUOUS VAPOR DEPOSITION OF SILICON ON SUBSTRATES
Antrags-/Publikationsnummer:
18
793404
Datum:
2018-10-25
Antragsteller:
NEXWAFE GMBH
METHOD FOR ARRANGING A PLURALITY OF SEED SUBSTRATES ON A CARRIER ELEMENT AND CARRIER ELEMENT HAVING SEED SUBSTRATES
Antrags-/Publikationsnummer:
17
761219
Datum:
2017-08-24
Antragsteller:
NEXWAFE GMBH
