Skip to main content
Przejdź do strony domowej Komisji Europejskiej (odnośnik otworzy się w nowym oknie)
polski pl
CORDIS - Wyniki badań wspieranych przez UE
CORDIS

SKIN-like TWO-Dimensional materials-based elecTRONICS conformable to rough surfaces

Cel

The goal of SKIN2DTRONICS is to demonstrate the large scale integration (LSI, transistor count larger than 1000) of soft and thin (skin-like) electronic devices on ultra-flexible substrates, capable of conformally adapting to any rough and curved surface. This vision will be realized by atomically thin two-dimensional materials (2DMs) that possess compelling properties for this application: high electronic performance, environmental stability, low toxicity and cytoxicity, and extreme resilience to mechanical deformations.
With the increasing pressure towards ubiquitous electronics (wearables, Internet-of-Things, smart patches, etc.) it is urgent to develop electronics that can be easily integrated on the surface of everyday objects and, in the case of health monitoring applications, on a variety of rough biological surfaces. Today’s conformal electronics is mainly based on conformal sensors with flexible and stretchable electrodes interfaced to bulky silicon chips, responsible for processing. This approach is prone to mechanical failures, especially at the solderings, as the connection between the conformal and solid components remains very challenging.
The research will rely on the complementary conjuncture of four fields: sensors, 2D-based electronics, flexible electronics and biomedical engineering that the PIs of the consortium bring, each of them recognized experts in their respective fields and with a valuable experience in leading ERC projects.

Dziedzina nauki (EuroSciVoc)

Słowa kluczowe

Program(-y)

Temat(-y)

System finansowania

HORIZON-ERC-SYG - HORIZON ERC Synergy Grants

Wyświetl wszystkie projekty finansowane w ramach tego programu finansowania

Zaproszenie do składania wniosków

(odnośnik otworzy się w nowym oknie) ERC-2024-SyG

Wyświetl wszystkie projekty finansowane w ramach tego zaproszenia

Instytucja przyjmująca

UNIVERSITA DI PISA
Wkład UE netto
€ 2 399 375,00
Koszt całkowity
€ 2 399 375,00

Beneficjenci (4)