Obiettivo The objective of this project was to develop high density interconnect compatible with one micron MOS and bipolar VLSI technologies. This technology was to feature four levels of low resistivity metal interconnect with high electromigration resistance andstable, low-resistance contacts to the underlying silicon circuit. The objective of this project was to develop high density interconnect compatible with one micron metal oxide semiconductor (MOS) and bipolar very large scale integration (VLSI) technologies. This technology was to feature 4 levels of low resistivity metal interconnect with high electromigration resistance and stable, low resistance contacts to the underlying silicon circuit. The project achieved its overall objectives and demonstrated several advanced new techniques. The main milestones of the programme were:demonstration of 3-layer metal at 5 micron pitch;demonstration of 4-layer metal at 3 micron pitch.The first main milestone was reached and several variants of the developed structures for nonnested vias and pillars were evaluated by means of the final test mask.The fabrication of 100 per cent filled small vias with aluminium alloys was eventually demonstrated. Work on contact systems and tests on the reliability of polyamide and nitride produced very good results.The project achieved its overall objectives and demonstrated several advanced new techniques. The main milestones of the programme were: -demonstration of 3layer metal at 5micron pitch (September1986) -demonstration of 4-layer metal at 3micron pitch (March1987). The first main milestone was reached on time and several variants of the developed structures for non-nested vias and pillars were evaluated by means of the final test mask towards the final milestone. A major technical difficulty was encountered while setting up the final process. Although good progress had been made with optimised aluminium for step coverage, it was discovered that these conditions did not fill small holes such as contacts and vias. The work was therefore restructured and new sub-tasks added in order to reach the final milestone. The fabrication of 100% filled small vias with Al alloys was eventually demonstrated following close collaboration with advanced equipment manufacturers.Work on contact systems and tests on the reliability of polyimide and nitride also produced very good results. Exploitation All the partners make use of the developed interconnect results in their CMOS or bipolar processes. Plessey, notably, has transferred the 3layer metallisation scheme developed to its CMOS process. Campo scientifico scienze naturaliscienze chimichechimica inorganicacomposti inorganiciscienze naturaliscienze chimichechimica inorganicametalli di post-transizionescienze naturaliscienze fisicheelettromagnetismo ed elettronicasemiconduttivitàscienze naturaliscienze chimichechimica inorganicametalloidi Programma(i) FP1-ESPRIT 1 - European programme (EEC) for research and development in information technologies (ESPRIT), 1984-1988 Argomento(i) Data not available Invito a presentare proposte Data not available Meccanismo di finanziamento Data not available Coordinatore GEC Plessey Semiconductors plc Indirizzo Caswell NN12 8EQ Towcester Regno Unito Mostra sulla mappa Contributo UE Nessun dato Partecipanti (3) Classifica in ordine alfabetico Classifica per Contributo UE Espandi tutto Riduci tutto GEC-Marconi Materials Technology Ltd Regno Unito Contributo UE € 0,00 Indirizzo Elstree way WD6 1RX Borehamwood Mostra sulla mappa Altri finanziamenti Nessun dato Telefunken Microelectronic GmbH Germania Contributo UE € 0,00 Indirizzo Theresienstraße 2 74072 Heilbronn Mostra sulla mappa Altri finanziamenti Nessun dato Thomson CSF Francia Contributo UE € 0,00 Indirizzo 38 rue vauthier 92100 Boulogne-billancourt Mostra sulla mappa Altri finanziamenti Nessun dato
