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OPTISSIMO is a new powerful OPC (Optical Proximity Correction) tool set for proximity correction in optical lithography. The treatment of design data hierarchy and the implemented concept of the pattern library are key features. The achieved correction results for the enhancement of CD (Critical Dimension) uniformity and pattern fidelity demonstrate the advantage of OPTISSIMO for all design situations.
The pattern transfer process from chip layout to the structures on the finished wafer consists of many process steps. Although desired, none of these steps are linear in all aspects of the pattern transfer process. Approaching the process limits due to the ever-shrinking linewidth, the non-linearity of the pattern transfer clearly shows up. This means that one cannot continue the practice of summarising all process influences into one bias between the data used for mask making and the final chip structure. The correction of these non-linearities, called proximity effects, becomes more and more a necessity for achieving pattern fidelity and high yield. Applying such a proximity correction makes it possible to use a semiconductor production line one chip generation longer. Within the project, the validation and demonstration of OPTISSIMO, a software tool developed to perform proximity correction in optical lithography for full chip designs automatically, was the main focus. Based on state-of-the-art integrated circuit designs it was demonstrated that OPTISSIMO is capable of handling complete design data in reasonable time scales. The achieved pattern fidelity, reduction of line width deviation and performance enhancement compared to uncorrected designs has been shown and published at international conferences.
Project URL: http://www.aiss.com/OPTISSIMO/introduction.html
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