Cel The main objective of STATIC is to develop state-of-the-art application-specific power ICs (ASPICs) for telecommunications and automotive applications. In particular, Alcatel SESA is developing two power-integrated circuits (PIC 1 and 2) to be used in DC/DC converters at the primary and secondary sides of high-voltage telephone lines. In the automotive area, BMW is designing two demonstrators that will be particularly demanding in terms of temperature of operation, noise signal isolation and voltage range.Detailed target process and demonstrator specifications have been defined. Existing silicon based technologies are being improved in order to increase the degree of circuit functionality (by extending and optimizing the level of on chip integration of analogue and digital components). At the same time, voltages ranging from 30 V (PIC 2) to 150 V (PIC 1) have to be supported. Particular attention has been given to the comparison, simulation and optimization of the different high voltage devices. First measurements of reliability at wafer level have also been performed, to obtain feedback on quality/degradation characteristics at an early stage of process development and integration. Of particular interest were the quality of the high voltage capacitors and the hot carrier characteristics of the N-channel metal oxide semiconductor (NMOS) devices. An advanced silicon-on-insulator process for smart power applications is under development. The existing technology at 40 V needs to be extended to both high current (30 A) and higher voltages. Starting from the first feasibility test run and the evaluation of trench fabrication and epitaxial quality on separation by implantation of oxygen (SIMOX) material, a number of improvements have been achieved. The expected technological benefits with respect to bulk silicon technologies will be evaluated in the automotive and PIC 2 demonstrators. The cell library design is under way, with two primary objectives: to enforce cooperation between the different silicon vendors and the system houses, and to characterize all the critical cells that will be used for the demonstrators. Different device/circuit and thermal simulators have also been analyzed and composed.To achieve the above objective: - Detailed target process and demonstrator specifications have been defined at the start of the project. - Existing silicon-based technologies are being improved at Mietec and SGS-Thomson in order to increase the degree of circuit functionality (by extending and optimising the level of on-chip integration of analogue and digital components). At the same time, voltages ranging from 30 V (PIC 2) to 150 V (PIC 1) will have to be supported. Particular attention has been given to the comparison, simulation and optimisation of the different high voltage devices. First measurements of reliability at wafer level have also been performed, to obtain feed back on quality/degradation characteristics at an early stage of process development and integration. Of particular interest were the quality of the high-voltage capacitors and the hot carrier characteristics of the n-MOS devices - An advanced silicon-on-insulator process for "smart power" applications is under development by ELMOS in cooperation with the Fraunhofer Institute and CNM. The existing technology at 40 V needs in fact to be extended to both high current (30 A) and higher voltages. Starting from the first feasibility test run and the evaluation of trench fabrication and epitaxial quality on SIMOX, a number of improvements have been achieved. The expected technological benefits with respect to bulk silicon technologies will be evaluated in the automotive and PIC 2 demonstrators. - The cell library design is under way, with two primary objectives: to enforce cooperation between the different silicon vendors and the system houses, and to characterise all the critical cells that will be used for the demonstrators. Different device/circuit and thermal simulators have also been analysed and composed. A full characterisation of the circuit demonstrators will be carried out, including reliability and user qualification tests. It is also planned to show the system (DC/DC convertor improvements as a direct result of both PIC1 and PIC2 demonstrators, by comparing results obtained in STATIC with an existing reference system. Dziedzina nauki natural scienceschemical sciencesinorganic chemistryinorganic compoundsnatural sciencesphysical scienceselectromagnetism and electronicssemiconductivitynatural scienceschemical sciencesinorganic chemistrymetalloidsengineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunications Program(-y) FP3-ESPRIT 3 - Specific research and technological development programme (EEC) in the field of information technologies, 1990-1994 Temat(-y) Data not available Zaproszenie do składania wniosków Data not available System finansowania Data not available Koordynator ALCATEL SESA Wkład UE Brak danych Adres RAMIREZ DE PRADO, 5 28045 MADRID Hiszpania Zobacz na mapie Koszt całkowity Brak danych Uczestnicy (8) Sortuj alfabetycznie Sortuj według wkładu UE Rozwiń wszystko Zwiń wszystko BAYERISCHE MOTOREN WERKE AG (BMW) Niemcy Wkład UE Brak danych Adres PETUELRING 130 80809 MÜNCHEN Zobacz na mapie Koszt całkowity Brak danych BELL TELEPHONE MANUFACTURING Belgia Wkład UE Brak danych Adres RUE FRANCIS WELLESPLEIN, 1 2018 ANTWERPEN Zobacz na mapie Koszt całkowity Brak danych Centro Nacional de Microelectronica Hiszpania Wkład UE Brak danych Adres Campus Uab 08193 Bellaterra Zobacz na mapie Koszt całkowity Brak danych ELMOS Niemcy Wkład UE Brak danych Adres EMIL FIGGE STRAßE 81 44227 DORTMUND Zobacz na mapie Koszt całkowity Brak danych Fraunhofer-Gesellschaft zur Förderungder Angewandten Forschung e.V. Niemcy Wkład UE Brak danych Adres Finkenstrasse 47057 Duisburg Zobacz na mapie Koszt całkowity Brak danych MIETEC Belgia Wkład UE Brak danych Adres WESTERRING, 15 9700 OUDENAARDE Zobacz na mapie Koszt całkowity Brak danych SGS THOMSON MICROELECTRONICS SA Francja Wkład UE Brak danych Adres 7 AVENUE GALLIENI 92253 GENTILLY Zobacz na mapie Koszt całkowity Brak danych Thomson Microelectronics Srl (SGS) Włochy Wkład UE Brak danych Adres Via Carlo Olivetti 20041 Agrate Brianza Milano Zobacz na mapie Koszt całkowity Brak danych