Periodic Reporting for period 1 - HYPHEN (HYPHEN: Hybrid Photonic Engines for Massive Cloud Connectivity)
Okres sprawozdawczy: 2015-08-01 do 2017-01-31
1 Summary for publication
The goal of HYPHEN was to explore and verify the commercial potential of a novel approach to hybrid photonic systems. The approach combines the benefits of a large-scale photonic integration with the design flexibility of discrete systems by exploiting the technique of photonic wire bonding. Photonic wire bonding was established and elaborated in the framework of the ERC Stating Grant EnTeraPIC (# 280145) and relies on three-dimensional nano-printing of single-mode optical waveguides between pre-positioned chips using direct-write two-photon lithography. Within HYPHEN, we have conducted an in-depth analysis of market opportunities and competitive boundary conditions, eliminated fundamental technical risks related to stability and automated large-scale production of photonic wire bonds, and established an IPR strategy for transferring the technology to industrial applications. Based on these results, we have formulated a three-step strategy for market entry along with the underlying business plans. The strategy was implemented in a first step by foundation of the start-up company Vanguard Photonics GmbH (www.vanguard-photonics.com) which has access to all relevant IP and which is currently seeking investment for the next phase of commercialization. Vanguard Photonics addresses emerging market opportunities with worldwide annual market volumes well above 100 million Euros such that the growth of revenue will be limited by the velocity with which we can sustainably expand our business rather than by the size of the overall addressable market.
The goal of HYPHEN was to explore and verify the commercial potential of a novel approach to hybrid photonic systems. The approach combines the benefits of a large-scale photonic integration with the design flexibility of discrete systems by exploiting the technique of photonic wire bonding. Photonic wire bonding was established and elaborated in the framework of the ERC Stating Grant EnTeraPIC (# 280145) and relies on three-dimensional nano-printing of single-mode optical waveguides between pre-positioned chips using direct-write two-photon lithography. Within HYPHEN, we have conducted an in-depth analysis of market opportunities and competitive boundary conditions, eliminated fundamental technical risks related to stability and automated large-scale production of photonic wire bonds, and established an IPR strategy for transferring the technology to industrial applications. Based on these results, we have formulated a three-step strategy for market entry along with the underlying business plans. The strategy was implemented in a first step by foundation of the start-up company Vanguard Photonics GmbH (www.vanguard-photonics.com) which has access to all relevant IP and which is currently seeking investment for the next phase of commercialization. Vanguard Photonics addresses emerging market opportunities with worldwide annual market volumes well above 100 million Euros such that the growth of revenue will be limited by the velocity with which we can sustainably expand our business rather than by the size of the overall addressable market.