Cel
A major problem in the take-up of microsystems is the assembly and packaging strategy to be used. No standard methodologies exist for assembly and packaging for silicon based sensor/actuators, due to the incompatibility of the application of the sensor/actuator with standard IC applications. Separation of the electrical contacts and the active area of the device would enable the application of more conventional IC assembly and packaging technologies, reducing costs and increase reliability. The goal of this trial is to combine integrated optics technology developed by Lion Photonix with Hymite's technology, to create electrical contacts on the back side of the chip. The combination of these technologies will enable easy assembly, reduce costs, especially for multi-channel devices such as multispecies sensors as well as telecom components such as OADM's and optical switches. In order to demonstrate the technology demonstrators will be made of an optical sensor and an OADM (optical add/drop multiplexer).
Objectives:
The main objective of this project is to provide integrated optics technologies, with back-side contacts for easy assembly and packaging. The application of the technology will be demonstrated for two devices: optical sensor and an OADM. Once the technology has been proven successful, it is expected that it can also be widely used for other microsystems technologies.
Work description:
The integrated optics technology of Lion Photonix has a large potential for sensors and telecom components. However, to optimally use the properties of this technology, adequate assembly and packaging schemes have to be available to ensure a quick up-take of the technology by the European Industry. Recently, a method is developed by Hymite to create feed-throughs in a silicon chip to enable back-side contacting. Combination of the above technologies would enable the end-users to get a more reliable microsystem for lower costs. In order to evaluate the potential of these technologies, test devices have to be made to adapt, fine-tune and integrate the available process schemes.
The following activities will be executed:
- An optical sensor system will be defined in close collaboration with the end-user and demonstrators realized;
- An optical add/drop multiplexer will be defined in close collaboration with the end-user and demonstrators realized;
- Dissemination and awareness raising of possibilities of the total technology solution for assembly and packaging of microsystems.
Milestones:
1. Demonstrator of an optical sensing system;
2. Demonstrator of an add/drop multiplexing system;
3. Guidelines and design rules for manufacturing of feed-throughs;
4. Guidelines for assembly and packaging of chips with feed-throughs;
5. Dissemination of the results, resulting in an increased up-take of microsystem technology.
Dziedzina nauki (EuroSciVoc)
Klasyfikacja projektów w serwisie CORDIS opiera się na wielojęzycznej taksonomii EuroSciVoc, obejmującej wszystkie dziedziny nauki, w oparciu o półautomatyczny proces bazujący na technikach przetwarzania języka naturalnego.
Klasyfikacja projektów w serwisie CORDIS opiera się na wielojęzycznej taksonomii EuroSciVoc, obejmującej wszystkie dziedziny nauki, w oparciu o półautomatyczny proces bazujący na technikach przetwarzania języka naturalnego.
- inżynieria i technologiainżynieria elektryczna, inżynieria elektroniczna, inżynieria informatycznainżynieria elektronicznaczujnikiczujniki optyczne
- nauki przyrodniczenauki fizyczneoptyka
- nauki przyrodniczenauki chemicznechemia nieorganicznametaloidy
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Zaproszenie do składania wniosków
Data not availableSystem finansowania
ACM - Preparatory, accompanying and support measuresKoordynator
7522 NB ENSCHEDE
Niderlandy