Descrizione del progetto
Una tecnologia fotonica integrata e di confezionamento rivoluzionaria
Il progetto PhotonicLEAP, finanziato dall’UE, intende sviluppare un rivoluzionario circuito fotonico integrato (PIC), un imballaggio su scala wafer e una tecnologia di verifica che può essere replicata su qualsiasi dimensione. Il progetto sfrutterà i nuovi sviluppi per la realizzazione di un pacchetto di tecnologia a montaggio superficiale che incorporerà per la prima volta più connessioni ottiche ed elettriche. L’approccio basato sulla tecnologia a montaggio superficiale di PhotonicLEAP è destinato a diventare un nuovo standard globale per l’imballaggio PIC conveniente e la verifica PIC ad alta produttività. Le tecnologie saranno convalidate in due dimostratori all’avanguardia: un modulo di comunicazione ottica ad alta velocità e un dispositivo medico portatile per la diagnostica cardiovascolare. L’approccio di PhotonicLEAP ridurrà il costo di produzione di PIC di oltre 10 volte, rivoluzionando le applicazioni esistenti e aprendo la strada a mercati completamente nuovi.
Obiettivo
PhotonicLEAP will develop a disruptive wafer-level PIC module integration, packaging and test technology which can be scaled from low to very large volumes. PhotonicLEAP will use this disruptive technology to produce a revolutionary Surface Mount Technology (SMT) PIC package, which for the first time incorporates multiple optical and electrical connections. SMT is the most widely used, cost-effective and standardised package in the electronics world and PhotonicLEAP’s standardised SMT approach is set to follow, becoming a new global standard for cost-effective PIC packaging and high-throughput PIC testing. PhotonicLEAP will also develop standardised packaging design rules formalised into a Process Design Kit (PDK), providing users with easy access to the project technology through Open Access and commercial PIC design software tools. The project will validate these technologies through two state-of-the-art demonstrators, including a high-speed optical communication module and a portable medical device for cardio-vascular diagnostics. PhotonicLEAP’s approach will reduce the cost of PIC production by over 10 times, revolutionising existing applications and creating completely new markets. The project workplan includes high-quality measures to Exploit and Disseminate PhotonicLEAP’s results, including management of IP and research data, and to Communicate project activities to different target audiences. A key exploitation measure involves technology transfer to the flagship European PIC Packaging Pilot Line, PIXAPP, which has an extensive and growing user-base across multiple markets. PhotonicLEAP will be delivered by a highly experienced consortium with an unmatched record of excellence in developing and delivering many world firsts in PIC packaging, test technologies and advanced services. The consortium brings a wealth of interdisciplinary skills and state-of-the-art infrastructure to deliver on the project’s ambitious objectives.
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Meccanismo di finanziamento
RIA - Research and Innovation actionCoordinatore
T12 YN60 Cork
Irlanda