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Metrology Advances for Digitized ECS industry 4.0

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Publikacje

Atomistic Simulation of Ultra-Fast Annealing Processes (Invited Talk)

Autorzy: Antonino La Magna
Opublikowane w: EMRS (European Material Research Society) Fall, 2022 September 19-23, 2022
Wydawca: Elsevier

Predictive virtual processes, metrology and maintenance in power device manufacturing

Autorzy: Antonino La Magna (CNR), Umberto Amato (CNR), Daniele Pagano (ST-I), Patrizia Vasquez (ST-I), Anastasiia Doinychko (MENTOR), Andrea Calimera (POLITO), Alex Rosenbaum (MELLANOX), Marius Enachescu (UPB), Ioannis Deretzis (CNR)
Opublikowane w: "ISBIS CONFERENCE 2022 on ""Statistics and Data Science in Business and Industry""", 2022, Strona(/y) 37, ISBN 979-12-210-1389-4
Wydawca: ISBIS

Structural and electrical characterization of Ni-based ohmic contacts on 4H-SiC formed by solid-state laser annealing

Autorzy: Paolo Badalà, Emanuele Smecca, Simone Rascunà, Corrado Bongiorno, Egidio Carria, Anna Bassi, Gabriele Bellocchi, Cristina Tringali, Antonino La Magna and Alessandra Alberti
Opublikowane w: 13th European Conference on Silicon Carbide and Related materials ECSCRM 2021, 2021
Wydawca: ECSCRM

TXRF/GIRXF high precision laboratory setup with high flux monochromatic sources

Autorzy: Claudia G. Fatuzzo, Philipp Hönicke, Claudia Caliri, Roberta Ricciari, Daniele Pagano, Andreas G. Karydas, Francesco Paolo Romano
Opublikowane w: EXRS2022 European Conference on X-ray Spectrometry 2022, 2022
Wydawca: EXRS2022

MFIG - a Mass Filtered Ion Gauge

Autorzy: Bekman, H.H.P.T. Westland, Y. Elstgeest, T.H. Mechielsen, T.W. Haye, M.J. Emmelkamp, J. Molkenboer, F.T. Koster, N.B. Lensen, H.A.
Opublikowane w: 2022
Wydawca: IVC-22, 22nd International Vacuum Congress (https://ivc22.org/)

A fusion of electronic design, process and metrology in semiconductor manufacturing for improved process optimization and control

Autorzy: Anastasiia Doinychko, Andres Torres, Ivan Kissiov, Melody Tao, Sanghyun Choi (Mentor - S-EDA)
Opublikowane w: "ISBIS CONFERENCE 2022 on ""Statistics and Data Science in Business and Industry""", 2022, Strona(/y) PAg.34, ISBN 979-12-210-1389-4
Wydawca: ISBIS

Industry4.0 Productivity Improvement in Major EU Fabs

Autorzy: Daniele Pagano (ST-I)
Opublikowane w: Webinar: Next Generation Inspection and Metrology Solutions, 2022
Wydawca: SEMI

Chasing Abnormalities on Time Series for Predictive Maintenance and Advanced Process Control

Autorzy: C. Girou, F. Bergeret, D. Pagano, P. Vasquez, G. Prinzivalli, G. Tochino
Opublikowane w: 20th European Advanced Process Control and Manufacturing Conference (apc|m), 2022
Wydawca: APCM - Silicon Saxony

Ni-silicide ohmic contacts on 4H-SiC formed by multi pulse excimer laser annealing

Autorzy: P. Badalà (ST-I), I. Deretzis (CNR), S. Sanzaro (CNR), C. Bongiorno (CNR), G. Fisicaro (CNR), S. Rascunà (ST-I), G. Bellocchi (ST-I), A. Bassi (ST-I), M. Boscaglia (ST-I), D. Pagano (ST-I), P. Vasquez (ST-I), M. Enachescu (UPB), A. Alberti (CNR), A. La Magna (CNR)
Opublikowane w: ICSCRM 2022 (International Conference on Silicon Carbide and Related Materials) 19th International Conference on Silicon Carbide and Related Materials, 2022, Strona(/y) Pag.42
Wydawca: ICSCRM

Multiscale simulations of plasma etching in silicon carbide structures

Autorzy: M.Italia, I.Deretzis, S.Scalese, A.La Magna, M.Pirnaci, D.Pagano, D.Tenaglia, P.Vasquez
Opublikowane w: 13th European Conference on Silicon Carbide and Related materials ECSCRM 2021, 2021
Wydawca: ECSCRM

Block copolymer line roughness measurement via PSD: application to fingerprint samples

Autorzy: Aurélie Le Pennec, Jérôme Rêche, Patrick Quéméré, Guido Rademaker, Romain Jarnias, Charlotte Bouet, Célia Nicolet, Christophe Navarro, Maxime Argoud, Raluca Tiron
Opublikowane w: 2020
Wydawca: SPIE
DOI: 10.1117/12.2551854

TXRF/GIRXF high precision laboratory setup with high flux monochromatic sources for archeometric applications

Autorzy: Claudia G. Fatuzzo, Philipp Hönicke, Claudia Caliri, Andreas Karydas and Francesco Paolo Romano
Opublikowane w: 107th National Congress - Italian Physical Society, 2021
Wydawca: SIF

A Comparative Evaluation of Deep Learning Anomaly Detection Techniques on Semiconductor Multivariate Time Series Data

Autorzy: Philip Tchatchoua, Guillaume Graton, Mustapha Ouladsine, Michel Juge
Opublikowane w: IEEE 17th International Conference on Automation Science and Engineering (CASE), 2021
Wydawca: IEEE
DOI: 10.1109/case49439.2021.9551541

Health Indicator for Batch Processes Based on SP-LASSO

Autorzy: Dima el Jamal, Bouchra Ananou, Guillaume Graton, Mustapha Ouladsine, Jacques Pinaton
Opublikowane w: 2022
Wydawca: IFAC
DOI: 10.1016/j.ifacol.2022.07.156

Closed-loop active object recognition with constrained illumination power

Autorzy: Jacques Noom, Oleg Soloviev, Carlas Smith, Michel Verhaegen
Opublikowane w: Proc. SPIE 12102, Real-Time Image Processing and Deep Learning 2022, Numer 1210203 (27 May 2022), 2022
Wydawca: SPIE
DOI: 10.1117/12.2618750

Establishing a sidewall image transfer chemo-epitaxial DSA process using 193 nm immersion lithography

Autorzy: G. J. Rademaker, A. Le Pennec, T. J. Giammaria, K. Benotmane, H. Pham, C. Bouet, M. G. Gusmao Cacho, M. Argoud, M.-L. Pourteau, A. Paquet, A. Gharbi, C. Navarro, C. Nicolet, X. Chevalier, K. Sakavuyi, P. Nealey, R. Tiro
Opublikowane w: 2020
Wydawca: SPIE
DOI: 10.1117/12.2552003

Particle detection using closed-loop active model diagnosis

Autorzy: Jacques Noom, Oleg Soloviev, Carlas Smith, Hieu Thao Nguyen, Michel Verhaegen
Opublikowane w: Proc. SPIE 12019, AI and Optical Data Sciences III, Numer 120190F (2 March 2022), 2022
Wydawca: SPIE
DOI: 10.1117/12.2605452

High Throughput Scanning Probe Metrology for High-NA EUV photoresist profiling

Autorzy: Artem Khatchaturiants, Marta Mucientes, Arseniy Kalinin, Yan Guo, Seokhan Kim, Alain Moussa, Janusz Bogdanowicz, Joren Severi, Gian Lorusso, Danilo De Simone, Anne-Laure Charley, Philippe Leray, Maarten E. van Reijzen, Cornel Bozdog, Hamed M. Sadeghian
Opublikowane w: Proceedings SPIE Volume PC12053, Metrology, Inspection, and Process Control XXXVI; PC120530I (2022), 2022
Wydawca: SPIE
DOI: 10.1117/12.2616089

Data fusion by artificial neural network for hybrid metrology development

Autorzy: L. Penlap Woguia, J. Reche, M. Besacier, P. Gergaud, G. Rademaker
Opublikowane w: 2021
Wydawca: SPIE
DOI: 10.1117/12.2583590

TXRF/GIXRF high precision laboratory setup with high flux monochromatic source

Autorzy: Claudia G. Fatuzzo, Philipp Hönicke, Claudia Caliri, Roberta Ricciari, Daniele Pagano, Andreas G. Karydas, Patrizia Vasquez, Francesco Paolo Romano
Opublikowane w: 6th PTB Seminar - VUV and EUV Metrology, 2021
Wydawca: PTB

LASSO-based Health Indicator Extraction Method for Semiconductor Manufacturing Processes

Autorzy: Dima el Jamal, Bouchra Ananou, Guillaume Graton, Mustapha Ouladsine, Jacques Pinaton
Opublikowane w: 2022
Wydawca: IEEE
DOI: 10.23919/ecc55457.2022.9838058

Multi-branch neural network for hybrid metrology improvement

Autorzy: P. Digraci, M. Besacier, P. Gergaud, G. Rademaker, J. Reche
Opublikowane w: 2022
Wydawca: SPIE
DOI: 10.1117/12.2612798

Closed-Loop Active Model Diagnosis Using Bhattacharyya Coefficient: Application to Automated Visual Inspection.

Autorzy: Noom, J., Thao, N.H., Soloviev, O., Verhaegen, M.
Opublikowane w: Intelligent Systems Design and Applications. ISDA 2020. Advances in Intelligent Systems and Computing, vol 1351, 2021
Wydawca: Springer
DOI: 10.1007/978-3-030-71187-0_60

Similarity-based Brownian Motion Approach for Remaining Useful Life Prediction

Autorzy: Dima el Jamal, Bouchra Ananou, Guillaume Graton, Mustapha Ouladsine, Jacques Pinaton
Opublikowane w: International Conference on Control, Automation and Diagnosis (ICCAD), 2021
Wydawca: IEEE
DOI: 10.1109/iccad52417.2021.9638776

Virtual Metrology to Eliminate Test Wafers Measurements on Copper Electroplating Deposition

Autorzy: A. Doinychko, U. Amato, S. Raitsyn, S. Perna, F. Blundo, C. Genua, D. Vinciguerra, A. La Magna, A. Torres, A. Rosenbaum, M.-R. Amini, and P. Vasquez
Opublikowane w: 2021 IEEE 17th International Conference on Automation Science and Engineering, 2021
Wydawca: IEEE

High-NA EUV photoresist metrology using high-throughput scanning probe microscopy

Autorzy: M. Mucientes, A. Khachaturiants, R. Trussell, A. Kalinin, Y. Guo, E. C. Simons, S. Kim, O. Nadyarnykh, A. Moussa, J. Bogdanowicz, J. Severi, G. Lorusso, D. De Simone, A.-L. Charley, P. Leray, M. E. van Reijzen, C. Bozdog, H. Sadeghian
Opublikowane w: Proceedings Volume 12325, Photomask Japan 2022: XXVIII Symposium on Photomask and Next-Generation Lithography Mask Technology; 123250M (2022), Numer XXVIII, 2022
Wydawca: SPIE
DOI: 10.1117/12.2641698

Predictive discarding of wafers based on power leakage predictions from single layer misalignment data

Autorzy: Geert H. van Kollenburg, Mike Holenderski, Patrizia Vasquez, Nirvana Meratnia
Opublikowane w: ISM 2021 - International Conference on Industry 4.0 and Smart Manufacturing, 2022
Wydawca: Procedia Computer Science - Elsevier

Increase of wafer inspection tool throughput with computational imaging

Autorzy: Oleg Soloviev, Hieu Thao Nguyen, Jacques Noom, and Michel Verhaegen
Opublikowane w: Proc. SPIE 12098, Dimensional Optical Metrology and Inspection for Practical Applications XI, Numer 120980G (31 May 2022), 2022
Wydawca: SPIE
DOI: 10.1117/12.2618736

Phase retrieval from overexposed PSF: a projection-based approach

Autorzy: Oleg Soloviev, Jacques Noom, Hieu Thao Nguyen, Gleb Vdovin, and Michel Verhaegen
Opublikowane w: Proc. SPIE 11970, Quantitative Phase Imaging VIII, Numer 119700K (2 March 2022), 2022
Wydawca: SPIE
DOI: 10.1117/12.2609697

Modelling Ion Production inside an Electron Impact Ionizer for High-Vacuum Gas Analysis

Autorzy: J. Emmelkamp, F.T. Molkenboer, H.H.P.Th. Bekman, J. van den Brink, D.A. Wismeijer, N.B. Koster, D.J. Maas, O. Kievit, H.A. Lensen
Opublikowane w: 2020
Wydawca: COMSOL AB

Ensemble Machine Learning Algorithms for Anomaly Detection in Multivariate Time-Series

Autorzy: Youssef Trardi, Bouchra Ananou, Philip Tchatchoua, Mustapha Ouladsine
Opublikowane w: International Conference on Control, Automation and Diagnosis (ICCAD), 2022
Wydawca: IEEE
DOI: 10.1109/iccad55197.2022.9853995

Multi party privacy preserving machine learning for process control

Autorzy: Wilfried Verachtert, Tom Ashby, Imen Chakroun, Roel Wuyts, Sayantan Das, Sandip Halder, Philippe Leray
Opublikowane w: Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV, 2021, Strona(/y) 42, ISBN 9781510640566
Wydawca: SPIE
DOI: 10.1117/12.2584893

1D ResNet for Fault Detection and Classification on Sensor Data in Semiconductor Manufacturing

Autorzy: Philip Tchatchoua, Guillaume Graton, Mustapha Ouladsine, Julien Muller, Abraham Traore, Michel Juge
Opublikowane w: International Conference on Control, Automation and Diagnosis (ICCAD), 2022
Wydawca: IEEE
DOI: 10.1109/iccad55197.2022.9853997

Semiconductor Multivariate Time-Series Anomaly Classification Based on Machine Learning Ensemble Techniques

Autorzy: Samia Mellah, Youssef Trardi, Guillaume Graton, Bouchra Ananou, El Mostafa El Adel, Mustapha Ouladsine
Opublikowane w: 2022
Wydawca: IFAC
DOI: 10.1016/j.ifacol.2022.07.174

Combining Approaches of Brownian Motion and Similarity Principle to Improve the Remaining Useful Life Prediction

Autorzy: Dima el Jamal, Mohamed Al-Kharaz, Bouchra Ananou, Guillaume Graton, Mustapha Ouladsine, Jacques Pinaton
Opublikowane w: IEEE International Conference on Prognostics and Health Management (ICPHM), 2021
Wydawca: IEEE
DOI: 10.1109/icphm51084.2021.9486507

A semi-analytical approach for the characterization of ordered 3D nano structures using grazing-incidence X-ray fluorescence

Autorzy: Nikolaev, K. V.; Soltwisch, V.; Hoenicke, P.; Scholze, F.; de la Rie, J.; Yakunin, S. N.; Makhotkin, I. A.; van de Kruijs, R. W. E.; Bijkerk, F.
Opublikowane w: Journal of Synchrotron Radiation, Numer 27, 2020, Strona(/y) 386-395, ISSN 0909-0495
Wydawca: Blackwell Publishing Inc.
DOI: 10.1107/s1600577519016345

Convex combination of alternating projection and Douglas–Rachford operators for phase retrieval

Autorzy: Nguyen Hieu Thao, Oleg Soloviev, Michel Verhaegen
Opublikowane w: Advances in Computational Mathematics, Numer 47/3, 2021, ISSN 1019-7168
Wydawca: Kluwer Academic Publishers
DOI: 10.1007/s10444-021-09861-y

Robust Classification of Intramuscular EMG Signals to Aid the Diagnosis of Neuromuscular Disorders

Autorzy: Shobha Jose, S. Thomas George, M. S. P. Subathra, Vikram Shenoy Handiru, Poornaselvan Kittu Jeevanandam, Umberto Amato, Easter Selvan Suviseshamuthu
Opublikowane w: IEEE Open Journal of Engineering in Medicine and Biology, Numer 1, 2020, Strona(/y) 235-242, ISSN 2644-1276
Wydawca: IEEE Access
DOI: 10.1109/ojemb.2020.3017130

Study of plasma etching impact on chemoepitaxy directed self-assembly

Autorzy: Maria Gabriela Gusmão Cachoa), Khatia Benotmane, Aurélie Le Pennec, Charlotte Bouet, Patricia Pimenta-Barros, Guido Rademaker, Maxime Argoud, Raluca Tiron, and Nicolas Possémé
Opublikowane w: Journal of Vacuum Science and Technology A, 2021, ISSN 0734-2101
Wydawca: American Institute of Physics
DOI: 10.1116/6.0000850

Predictive discarding for sustainable Industry 5.0

Autorzy: Geert van Kollenburg (TU/e), Mike Holenderski (TU/e), Nirvana Meratnia (TU/e), Daniele Pagano (ST-I), Patrizia Vasquez (ST-I)
Opublikowane w: Research Outreach, Numer 132, 2022, ISSN 2517-7028
Wydawca: Research Outreach

Phase Retrieval from Overexposed PSF with Projection Methods

Autorzy: O.A. Soloviev
Opublikowane w: Optics Communications, 2022, ISSN 0030-4018
Wydawca: Elsevier BV

Electrodeposition of NiSn-rGO Composite Coatings from Deep Eutectic Solvents and Their Physicochemical Characterization

Autorzy: S.P. Rosoiu, A.G. Pantazi, A. Petica, A. Cojocaru, S. Costovici, C. Zanella, T. Visan, L. Anicai and M. Enachescu
Opublikowane w: Metals, Numer 20754701, 2020, Strona(/y) 1455, ISSN 2075-4701
Wydawca: MDPI Publishing Services
DOI: 10.3390/met10111455

Automatic Defect Detection in Epitaxial Layers by Micro Photoluminescence Imaging

Autorzy: Jacopo Frascaroli (1), Marta Tonini (1), Selene Colombo (1), Luisito Livellara (1), Luca Mariani (1), Paolo Targa (1), Roberto Fumagalli (1), Viktor Samu (2), Máté Nagy (2), Gábor Molnár (2), Áron Horváth (2), Zoltán Bartal (2), Zoltán Kiss (2),Tamás Sipőcz (2), Isabella Mica (1). (1) STMicroelectronics, Agrate Brianza, Italy (2) Semilab Semiconductor Physics Laboratory Company Ltd., B
Opublikowane w: IEEE Transactions on Semiconductor Manufacturing, Numer Volume: 35, Numer: 3, August 2022, 2022, Strona(/y) 540 - 545, ISSN 0894-6507
Wydawca: Institute of Electrical and Electronics Engineers
DOI: 10.1109/tsm.2022.3189847

Inter-diffusion, melting and reaction interplay in Ni/4H-SiC under excimer laser annealing

Autorzy: Salvatore Sanzaro, Corrado Bongiorno, Paolo Badalà, Anna Bassi, Giovanni Franco, Patrizia Vasquez, Alessandra Alberti, Antonino La Magna
Opublikowane w: Applied Surface Science, Numer 539, 2021, Strona(/y) 148218, ISSN 0169-4332
Wydawca: Elsevier BV
DOI: 10.1016/j.apsusc.2020.148218

Simulations of the Ultra-Fast Kinetics in Ni-Si-C Ternary Systems under Laser Irradiation

Autorzy: Salvatore Sanzaro, Corrado Bongiorno, Paolo Badalà, Anna Bassi, Ioannis Deretzis, Marius Enachescu, Giovanni Franco, Giuseppe Fisicaro, Patrizia Vasquez, Alessandra Alberti, Antonino La Magna
Opublikowane w: Materials, Numer 14/16, 2021, Strona(/y) 4769, ISSN 1996-1944
Wydawca: MDPI Open Access Publishing
DOI: 10.3390/ma14164769

MFIG — A Mass Filtered Ion Gauge

Autorzy: Herman Bekman , Jurjen Emmelkamp, Youyou Westland, Dorus Elstgeest, Thomas Mechielsen, Michael Haye, Freek Molkenboer, Norbert Koster, Henk Lensen
Opublikowane w: e-Journal of Surface Science and Nanotechnology, 2023, ISSN 1348-0391
Wydawca: Surface Science Society of Japan
DOI: 10.1380/ejssnt.2023-059

An optical system and image processing tool for predicting PIN malfunctioning in growth Chambers of semiconductors

Autorzy: U. Amato (CNR), A. Antoniadis (CNR), D.Fazio (ST-I), C. Genua (ST-I), D. Granata (CNR), A. Lamagna (CNR), D. Pagano (ST-I), G. Tochino (ST-I), P. Vasquez (ST-I)
Opublikowane w: Sensors, 2022, ISSN 1424-8220
Wydawca: Multidisciplinary Digital Publishing Institute (MDPI)

Wavelet-based robust estimation and variable selection in nonparametric additive models

Autorzy: Umberto Amato, Anestis Antoniadis, Italia De Feis,Irène Gijbels
Opublikowane w: Statistics and Computing, Numer Vol. 32, Numer 11, February 2022, 2022, ISSN 0960-3174
Wydawca: Kluwer Academic Publishers
DOI: 10.1007/s11222-021-10065-z

High-Speed Tapping Mode AFM Utilizing Recovery of Tip-Sample Interaction

Autorzy: J. Noom, C. Smith, G. J. Verbiest, A. J. Katan, O. Soloviev and M. Verhaegen
Opublikowane w: IEEE Transactions on Nanotechnology, Numer vol. 22, 2023, Strona(/y) 273-279, ISSN 1941-0085
Wydawca: IEEE
DOI: 10.1109/tnano.2023.3284654

Prediction of Yield in semiconductor production from defects optically detected on the Wafers

Autorzy: U. Amato (CNR), A. Antoniadis (CNR), A. Doinychko (Mentor), A. Lamagna (CNR), D. Pagano (ST-I), F. Piccinini (ST-I), E. Selvan (CNR), C. Severgnini (ST-I), A. Torres (Mentor), P. Vasquez (ST-I)
Opublikowane w: ASMBI - Applied Stochastic Models in Business and Industry (formerly Applied Stochastic Models and Data Analysis), 2022, ISSN 1524-1904
Wydawca: John Wiley & Sons Inc.

Pulsed Laser Deposition of SWCNTs on Carbon Fibres: Effect of Deposition Temperature

Autorzy: C.C. Moise, L. Rachmani, G.V. Mihai, O.A. Lazar, M. Enachescu, N. Naveh
Opublikowane w: Polymers, Numer 20734360, 2021, Strona(/y) 1138, ISSN 2073-4360
Wydawca: MDPI Publishing Services
DOI: 10.3390/polym13071138

Analysis of Line-Edge Roughness Using EUV Scatterometry

Autorzy: A. Fernández Herrero, F. Scholze, G. Dai, V. Soltwisch
Opublikowane w: Nanomanufacturing and Metrology, Numer 2520811X, 2022, Strona(/y) 149–158, ISSN 2520-811X
Wydawca: Springer
DOI: 10.1007/s41871-022-00126-w

Flexible, boundary adapted, nonparametric methods for the estimation of univariate piecewise-smooth functions

Autorzy: Umberto Amato, Anestis Antoniadis, Italia De Feis
Opublikowane w: Statistics Surveys, Numer 14/none, 2020, ISSN 1935-7516
Wydawca: Institute of Mathematical Statistics
DOI: 10.1214/20-ss128

Penalized wavelet estimation and robust denoising for irregular spaced data

Autorzy: Umberto Amato, Anestis Antoniadis, Italia De Feis, Irène Gijbels
Opublikowane w: Computational Statistics, Numer Volume 36 Numer 4, December 2021, 2021, ISSN 0943-4062
Wydawca: Physica-Verlag Gmbh und Co.
DOI: 10.1007/s00180-021-01174-4

PROLIFIC: A Fast and Robust Profile-Likelihood-Based Muscle Onset Detection in Electromyogram Using Discrete Fibonacci Search

Autorzy: Easter S. Suviseshamuthu, Didier Allexandre, Umberto Amato, Biancamaria Della Vecchia, Guang H. Yu
Opublikowane w: IEEE Access, Numer 8, 2020, Strona(/y) 105362-105375, ISSN 2169-3536
Wydawca: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2020.3000693

Penalised robust estimators for sparse and high-dimensional linear models

Autorzy: Umberto Amato, Anestis Antoniadis, Italia De Feis, Irene Gijbels
Opublikowane w: Statistical Methods & Applications, Numer 30/1, 2021, Strona(/y) 1-48, ISSN 1618-2510
Wydawca: Springer Verlag
DOI: 10.1007/s10260-020-00511-z

Selective plasma etching of silicon-containing high chi block copolymer for directed self-assembly (DSA) application

Autorzy: Maria Gabriela Gusmão Cacho, Khatia Benotmane, Patricia Pimenta-Barros, Charlotte Bouet, Guido Rademaker, Maxime Argoud, Christophe Navarro, Raluca Tiron, and Nicolas Possémé
Opublikowane w: Journal of Vacuum Science & Technology B, 2021, ISSN 2166-2746
Wydawca: AIP
DOI: 10.1116/6.0001102

Surface Topography of Si/TiO2 Stacked Layers on Silicon Substrate Deposited by KrF Excimer Laser Ablation

Autorzy: C.C. Moise, A. Pantazi, G.V. Mihai, A. Jderu, M. Bercu, A.A. Messina, M. Enachescu
Opublikowane w: Coatings, Numer 20796412, 2021, Strona(/y) 1350, ISSN 2079-6412
Wydawca: MDPI Publishing Services
DOI: 10.3390/coatings11111350

Projection methods for high numerical aperture phase retrieval

Autorzy: Nguyen Hieu Thao, Oleg Soloviev, Russell Luke, Michel Verhaegen
Opublikowane w: Inverse Problems, Numer 37, 125005, 2021, ISSN 0266-5611
Wydawca: Institute of Physics Publishing
DOI: 10.1088/1361-6420/ac3322

Simultaneous Dimensional and Analytical Characterization of Ordered Nanostructures

Autorzy: P. Hönicke, Y. Kayser, K.V. Nikolaev, V. Soltwisch, J.E. Scheerder, C. Fleischmann, T. Siefke, A. Andrle, G. Gwalt, F. Siewert, J. Davis, M. Huth, A. Veloso, R. Loo, D. Skroblin, M. Steinert, A. Undisz, M. Rettenmayr, B. Beckhoff
Opublikowane w: Small, Numer 16136810, 2021, Strona(/y) 2105776, ISSN 1613-6810
Wydawca: Wiley - V C H Verlag GmbbH & Co.
DOI: 10.1002/smll.202105776

Grazing incidence-X-ray fluorescence for a dimensional and elemental characterization of well-ordered nanostructures

Autorzy: Hönicke, Philipp; Andrle, Anna; Kayser, Yves; Nikolaev, Konstantin V.; Probst, Jürgen; Scholze, Frank; Soltwisch, Victor; Weimann, Thomas; Beckhoff, Burkhard
Opublikowane w: Nanotechnology, Numer 31, 2020, Strona(/y) 505709, ISSN 0957-4484
Wydawca: Institute of Physics Publishing
DOI: 10.1088/1361-6528/abb557

Uncertainties in the reconstruction of nanostructures in {EUV} scatterometry and grazing incidence small-angle X-ray scattering

Autorzy: A. Fernández Herrero, M. Pflüger, J. Puls, F. Scholze, V. Soltwisch
Opublikowane w: Optics Express, Numer 10944087, 2021, Strona(/y) 35580-35591, ISSN 1094-4087
Wydawca: Optical Society of America
DOI: 10.1364/oe.430416

Shape- and Element-Sensitive Reconstruction of Periodic Nanostructures with Grazing Incidence X-ray Fluorescence Analysis and Machine Learning.

Autorzy: Anna Andrle; Philipp Hönicke; Grzegorz Gwalt; Philipp-Immanuel Schneider; Yves Kayser; Frank Siewert; Victor Soltwisch
Opublikowane w: Nanomaterials, Numer 20794991, 2021, Strona(/y) 1647, ISSN 2079-4991
Wydawca: MPDI
DOI: 10.48550/arxiv.2102.06600

Prawa własności intelektualnej

APPARATUS AND METHOD FOR DEFECT DETECTION IN WORK PIECES

Numer wniosku/publikacji: 21 190120
Data: 2015-12-04
Wnioskodawca/wnioskodawcy: ICOS VISION SYSTEMS NV

APPARATUS, METHOD AND COMPUTER PROGRAM PRODUCT FOR DEFECT DETECTION IN WORK PIECES

Numer wniosku/publikacji: 15 865251
Data: 2015-12-04
Wnioskodawca/wnioskodawcy: ICOS VISION SYSTEMS NV

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