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3-D-integrated micro/nano modules for easily adapted applications

Cel

As electronic sensor systems are becoming more complex and individualised, standard state of the art approaches will not be anymore appropriate to meet the objectives (cost, reliability, time to market, etc.) of the future. The innovative approach presented here will realize e-CUBES, .i.e. investigate and develop 'small sensor cubes' which are wireless communicating among each other. The e-CUBES will build-up an ad-hoc network to realize the desired system functionality.

e-CUBES addresses various multi-disciplinary applications in the important field of wireless sensor networks, with special emphasis but not limited to the following key application areas:
- Distributed smart monitoring for Aeronautics and Space applications;
- Wireless sensor networks for Health and Fitness;
- Distributed intelligent Automotive Control.
Particular focus of e-CUBES is on the following technologies:
- Individual technologies at various layer levels, suitable for 3D integration;
- Layer processing/thinning technologies for 3D integration;
- 3D assembling and packaging;
- New communication means, e.g. antennas, passive and RF integration, and communication networks;
- Power supply and power management for portable applications;
- Design methodologies for the 3D SoC and related simulation tools.

The e-CUBES technology poses particular challenges with regard to the desirable sizes (a few cubic millimetres), the need to achieve continuous operation through an integrated or external wireless power supply, and the necessity of allowing multiple e-CUBES to communicate. The system is characterized by a large number of individual interconnected e-CUBES. The "e-CUBES" vision therefore represents a new approach to systems integration that will help to develop complex, flexible and cost-efficient.

System finansowania

IP - Integrated Project

Koordynator

INFINEON TECHNOLOGIES AG
Adres
Am Campeon 1-12
85579 Neubiberg
Niemcy

Uczestnicy (20)

3D PLUS SA
Francja
Adres
641 Rue Helene Boucher Zi
78530 Buc
COMMISSARIAT A L'ENERGIE ATOMIQUE
Francja
Adres
Batiment Le Ponant D, 25 Rue Leblanc
75015 Paris Cedex 15
ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE
FRAUNHOFER IAF
Niemcy
Adres
Tullastr. 72
79108 München
HONEYWELL ROMANIA SRL
Rumunia
Adres
Calea Floreasca 48B Sector 1
14462 Bucuresti
INFINEON TECHNOLOGIES AUSTRIA AG
Austria
Adres
Siemensstrasse 2
9500 Villach
INFINEON TECHNOLOGIES SENSONOR AS
Norwegia
Adres
Knudsroedveien 7
3189 Horten
INSTYTUT TECHNOLOGII ELEKTRONOWEJ
Polska
Adres
Al. Lotnikow 32/46
Warszawa
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
NXP SEMICONDUCTORS BELGIUM NV
Belgia
Adres
Interleuvenlaan 80
3001 Leuven
PHILIPS ELECTRONICS NEDERLAND B.V.
Niderlandy
Adres
Boschdijk 525
Postbus 90050 Eindhoven
PHILIPS INTERNATIONAL B.V.
Niderlandy
Adres
Groenewoudseweg 1
5621 BA Eindhoven
PHILIPS TECHNOLOGIE GMBH FORSCHUNGSLABORATORIEN AACHEN
Niemcy
Adres
Weisshausstrasse 2
52066 Aachen
TECHNISCHE UNIVERSITAET BERLIN
Niemcy
Adres
Strasse Des 17. Juni 135
Berlin
THALES ALENIA SPACE FRANCE
Francja
Adres
26 Avenue Jean-francois Champollion
31100 Toulouse
THALES SYSTEMES AEROPORTES S.A.
Francja
Adres
1 Bld Jean Moulin
78852 Elancourt
UNIVERSITAET PADERBORN
Niemcy
Adres
Warburger Strasse 100
33098 Paderborn
UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK
Irlandia
Adres
Western Road
Cork
UPPSALA UNIVERSITET
Szwecja
Adres
Sankt Olofsgatan 10B
75105 Uppsala