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Zawartość zarchiwizowana w dniu 2024-05-28

Nanoscale Silicon-Aware Network-on-Chip Design Platform

Opis projektu

Design of semiconductor components and electronic based miniaturised systems
The objective of this project is to develop an innovative network-on-chip oriented design platform constituting a toolkit for the construction of NoC-based multi-core systems in nanoscale technologies
The NaNoC project aims at developing an innovative design platform for future Network-on-Chip (NoC) based multi-core systems. This NaNoC design platform intends to master the design complexity of advanced microelectronic systems by enabling strict component oriented architectural design. A compositional approach to NoC design in future multi-core chips is out of the reach of current design methods and tools due to new design constraints. Requirements for co-design with high-level platform management frameworks facilitates a need for enhanced dynamism and flexibility in NoC composition (e.g. virtualization, power management, thermal management, application management). On the other hand, a higher degree of uncertainty originating from nanoscale integrated circuit fabrication technologies raises the need to build reliable systems out of unreliable components.The NaNoC design platform provides design methods and prototype tools to cope with both challenges and to make NoCs a mainstream interconnect backbone for effective system integration. The platform enables NoC component assembly at each layer of the design hierarchy. Therefore, design for manufacturability techniques and tools are developed to preserve yield in the presence of manufacturing defects and circuit performance/power variability.Above all, the NaNoC design platform fosters tight cooperation between system research, circuit design and process development by means of a silicon-aware decision making at each layer of the design hierarchy. In this direction, NaNoC not only provides a cross-layer approach to tackle composability challenges (e.g. physical design techniques for enhanced reliability combined with architecture-level techniques for fault containment), but also defines an exchange format for interoperability between design tools for cross-layer optimization. Interoperability between developed NoC design methods/prototype tools and mainstream design toolflows will also be pursued.

The NaNoC project aims at developing an innovative design platform for future Network-on-Chip (NoC) based multi-core systems. This NaNoC design platform intends to master the design complexity of advanced microelectronic systems by enabling strict component oriented architectural design. A compositional approach to NoC design in future multi-core chips is out of the reach of current design methods and tools due to new design constraints. Requirements for co-design with high-level platform management frameworks facilitates a need for enhanced dynamism and flexibility in NoC composition (e.g. virtualization, power management, thermal management, application management). On the other hand, a higher degree of uncertainty originating from nanoscale IC fabrication technologies raises the need to build reliable systems out of unreliable components.The NaNoC design platform provides design methods and prototype tools to cope with both challenges and to make NoCs a mainstream interconnect backbone for effective system integration. The platform enables NoC component assembly at each layer of the design hierarchy. Therefore, design for manufacturability techniques and tools are developed to preserve yield in the presence of manufacturing defects and circuit performance/power variability.Above all, the NaNoC design platform fosters the tight cooperation between system research, circuit design and process development by means of a silicon-aware decision making at each layer of the design hierarchy. In this direction, NaNoC not only provides a cross-layer approach to tackle composability challenges (e.g. physical design techniques for enhanced reliability combined with architecture-level techniques for fault containment), but also defines an exchange format for interoperability between design tools for cross-layer optimization. Interoperability between developed NoC design methods/prototype tools and mainstream design toolflows will also be pursued.

Dziedzina nauki (EuroSciVoc)

Klasyfikacja projektów w serwisie CORDIS opiera się na wielojęzycznej taksonomii EuroSciVoc, obejmującej wszystkie dziedziny nauki, w oparciu o półautomatyczny proces bazujący na technikach przetwarzania języka naturalnego. Więcej informacji: Europejski Słownik Naukowy.

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Program(-y)

Wieloletnie programy finansowania, które określają priorytety Unii Europejskiej w obszarach badań naukowych i innowacji.

Temat(-y)

Zaproszenia do składania wniosków dzielą się na tematy. Każdy temat określa wybrany obszar lub wybrane zagadnienie, których powinny dotyczyć wnioski składane przez wnioskodawców. Opis tematu obejmuje jego szczegółowy zakres i oczekiwane oddziaływanie finansowanego projektu.

Zaproszenie do składania wniosków

Procedura zapraszania wnioskodawców do składania wniosków projektowych w celu uzyskania finansowania ze środków Unii Europejskiej.

FP7-ICT-2009-4
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System finansowania

Program finansowania (lub „rodzaj działania”) realizowany w ramach programu o wspólnych cechach. Określa zakres finansowania, stawkę zwrotu kosztów, szczegółowe kryteria oceny kwalifikowalności kosztów w celu ich finansowania oraz stosowanie uproszczonych form rozliczania kosztów, takich jak rozliczanie ryczałtowe.

CP - Collaborative project (generic)

Koordynator

UNIVERSITAT POLITECNICA DE VALENCIA
Wkład UE
€ 513 763,00
Adres
CAMINO DE VERA SN EDIFICIO 3A
46022 VALENCIA
Hiszpania

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Region
Este Comunitat Valenciana Valencia/València
Rodzaj działalności
Higher or Secondary Education Establishments
Linki
Koszt całkowity

Ogół kosztów poniesionych przez organizację w związku z uczestnictwem w projekcie. Obejmuje koszty bezpośrednie i pośrednie. Kwota stanowi część całkowitego budżetu projektu.

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