Rezultaty
Experimental demonstration of high-mobility graphene encapsulated (for instance, sandwiched between hexagonal boron nitride layers) and integrated at the wafer scale.
Full transceiver/antenna subsystem with high performance ready for measurementsExperimental demonstration of the fabrication process for the integration of antenna and transceiver subsystems.
First co-integration of graphene antennas with full custom SiGe transceiversExperimental demonstration of the co-integration of the antenna and SiGe transceivers within the same system.
Report with area and power models from T32 as well as link latency and throughput models from T33
Graphene integration design reportReport with designs for the graphene component integration in WP2 and a quantitative analysis of the performance advantages with respect to conventional technologies
Channel modelChannel characterization models for inpackage wireless propagation in the frequency and time domains including coveragemultipath analysis
Heterogeneous System-on-ChipThis report will deliver the full systemonchip RTL and netlists as well as an evaluation of its performance and energy efficiency
Adaptive protocol stackReport delivering a comprehensive analysis of designs considered at the PHYMACNET layers with broad assessments of performancecost of the wireless network within package
Tunable and switchable graphene multiantenna reportSimulations of the achievable performance of tunability and beamsteering capabilities of graphenebased multiantenna solutions
AI applications workloadsThis report will deliver the specification of AI applications requirements necessary to derive initial architecture specifications
Die-level exploration at design-time/runtimeExploration optimization strategies task mapping strategies DVFS onthefly reconfiguration Identification of efficiencyperformancethermal tradeoffs
Package-level explorationExploration of machinelearning based strategies to optimize the task mapping allocation exploration of dielevel optimization strategies at package level and identified tradeoffs
A beta of the die-level simulator will be released to the partners and to the community. Contains a short tutorial.
Release of the open-source simulator with benchmark architecturesIt contains architectures optimized for a set of applications and can be updated until M36 (or beyond) with users’ feedback.
SiGe BiCMOS test devicesTx/Rx devices at three spot frequencies in the 60-312 GHz range will be provided to experimentally assess intra-/inter-chip communication channels.
In-Memory acceleratorThis report will deliver the in-memory accelerator specifications, as well as models for integration of the accelerators into the PULP clusters and high-level simulation models.
In this first deliverable, we will setup the website (tentatively: www.wiplash.eu) and public repository where papers and software will be uploaded. Moreover, we will setup the main communication channels in social media.
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IEEE
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10.1109/esscirc53450.2021.9567767
Autorzy:
Hayate Okuhara; Ahmed Elnaqib; Davide Rossi; Alfio Di Mauro; Philipp Mayer; Pierpaolo Palestri; Luca Benini
Opublikowane w:
2020 IEEE International Symposium on Circuits and Systems (ISCAS), 2020
Wydawca:
IEEE
DOI:
10.1109/iscas45731.2020.9181081
Autorzy:
Halima Najibi, Alexandre Levisse, Marina Zapater, Mohamed M. Sabry Aly, David Atienza
Opublikowane w:
Proceedings of the 2020 on Great Lakes Symposium on VLSI, 2020, Strona(/y) 513-518, ISBN 9781450379441
Wydawca:
ACM
DOI:
10.1145/3386263.3406923
Autorzy:
Fátima Rodríguez-Galán, Ama Bandara, Elana Pereira de Santana, Peter Haring Bolívar, Eduard Alarcón, Sergi Abadal
Opublikowane w:
IEEE Global Communications Conference 2023, 2023
Wydawca:
IEEE
DOI:
10.48550/arxiv.2309.01428
Autorzy:
Alexandre Levisse, Marco Rios, Miguel Peon-Quiros, David Atienza
Opublikowane w:
ICASSP 2020 - 2020 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP), 2020, Strona(/y) 1549-1552, ISBN 978-1-5090-6631-5
Wydawca:
IEEE
DOI:
10.1109/icassp40776.2020.9054524
Autorzy:
Ama Bandara; Fátima Rodríguez-Galán; Elana Pereira de Santana; Peter Haring Bolívar; Eduard Alarcón; Sergi Abadal
Opublikowane w:
10th ACM International Conference on Nanoscale Computing and Communication 2023, Numer 13, 2023
Wydawca:
ACM
DOI:
10.1145/3576781.3608723
Autorzy:
Gianmarco Ottavi; Geethan Karunaratne; Francesco Conti; Irem Boybat; Luca Benini; Davide Rossi
Opublikowane w:
2021 IEEE 3rd International Conference on Artificial Intelligence Circuits and Systems (AICAS), 2021, Strona(/y) 1-4
Wydawca:
IEEE
DOI:
10.1109/aicas51828.2021.9458409
Autorzy:
Mohammadreza F. Imani; Sergi Abadal; Philipp del Hougne
Opublikowane w:
Proceedings of the 1st ACM International Workshop on Nanoscale Computing, Communication, and Applications, 2020
Wydawca:
ACM
DOI:
10.1145/3416006.3431274
Autorzy:
Pathak, Karan ; Klein, Joshua Alexander Harrison ; Ansaloni, Giovanni ; Zapater Sancho, Marina ; Atienza Alonso, David
Opublikowane w:
RISC-V Summit Europe 2023, 2023, Strona(/y) 2
Wydawca:
RISC-V
Autorzy:
Gianmarco Ottavi, Angelo Garofalo, Giuseppe Tagliavini, Francesco Conti, Luca Benini, Davide Rossi
Opublikowane w:
2020 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 2020, Strona(/y) 512-517, ISBN 978-1-7281-5775-7
Wydawca:
IEEE
DOI:
10.1109/isvlsi49217.2020.000-5
Autorzy:
Simon, William Andrew, Alexandre Levisse, Marina Zapater, and David Atienza
Opublikowane w:
28th International Conference on Very Large Scale Integration (VLSI-SOC), 2020, Strona(/y) 94-99, ISBN 978-1-7281-5410-7
Wydawca:
IEEE
DOI:
10.1109/vlsi-soc46417.2020.9344087
Autorzy:
Nazareno Bruschi; Giuseppe Tagliavini; Angelo Garofalo; Francesco Conti; Irem Boybat; Luca Benini; Davide Rossi
Opublikowane w:
IEEE Design, Automation & Test in Europe Conference & Exhibition 2023, Numer 11, 2023, ISSN 1558-1101
Wydawca:
IEEE
DOI:
10.23919/date56975.2023.10137208
Autorzy:
Robert Guirado, Abbas Rahimi, Geethan Karunaratne, Eduard Alarcón, Abu Sebastian, Sergi Abadal
Opublikowane w:
2022 IEEE International Joint Conference on Neural Networks (IJCNN), 2022, ISBN 978-1-7281-8671-9
Wydawca:
IEEE
DOI:
10.1109/ijcnn55064.2022.9892243
Autorzy:
E. P. de Santana, A. K. Wigger, Z. Wang, K. Wang, M. Lemme, S. Abadal, P. H. Bolivar
Opublikowane w:
2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz), 2022, ISBN 978-1-7281-9427-1
Wydawca:
IEEE
DOI:
10.1109/irmmw-thz50927.2022.9895979
Autorzy:
Robert Guirado; Akshay Jain; Sergi Abadal; Eduard Alarcon
Opublikowane w:
2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021, Strona(/y) 1-5
Wydawca:
IEEE
DOI:
10.48550/arxiv.2103.10515
Autorzy:
Nazareno Bruschi, Giuseppe Tagliavini, Francesco Conti, Sergi Abadal, Alberto Cabellos-Aparicio, Eduard Alarcon, Geethan Karunaratne, Irem Boybat, Luca Benini, Davide Rossi
Opublikowane w:
2022 IEEE 4th International Conference on Artificial Intelligence Circuits and Systems (AICAS), 2022, ISBN 978-1-6654-0996-4
Wydawca:
IEEE
DOI:
10.1109/aicas54282.2022.9869996
Autorzy:
Joshua Klein; Alexandre Levisse; Giovanni Ansaloni; David Atienza; Marina Zapater; Martino Dazzi; Geethan Karunaratne; Irem Boybat; Abu Sebastian; Davide Rossi; Francesco Conti; Elana Pereira de Santana; Peter Haring Bolívar; Mohamed Saeed; Renato Negra; Zhenxing Wang; Kun-Ta Wang; Max C. Lemme; Akshay Jain; Robert Guirado; Hamidreza Taghvaee; Sergi Abadal
Opublikowane w:
ACM Computing Frontiers, 2021
Wydawca:
ACM
DOI:
10.1145/3457388.3458859
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